In order to support the Office of the Under Secretary of Defence for Research and Engineering’s (OUSD R&E) Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program, Lockheed Martin will collaborate with Altera, an Intel Company, and Intel Corporation. Using Altera’s Multi-Chip Package (MCP2), Lockheed Martin will build an airborne electronic defence system that is low in size, weight, and power (SWaP) and aligned with the Sensor Open Systems Architecture (SOSA). This system is intended to be deployed aboard the U.S. Navy’s MH-60R multi-mission helicopter. The National Security Technology Accelerator (NSTXL) will oversee the project, which was awarded through the Naval Surface Warfare Centre (NSWC) Crane Division Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle.
Deon Viergutz, vice president of spectrum convergence at Lockheed Martin, stated, “We are excited to work with Intel, Altera, and OUSD to provide a revolutionary leap in defence systems capabilities, utilizing high-performance U.S.-built semiconductors.” “This technology will be essential to the evolution of legacy systems and development of new systems that keep service members safe by controlling the electromagnetic spectrum and staying ahead of the threat in the modern battlespace against modern threats.”
“The most recent example of how we’re delivering industry-leading products via our chiplet technology is the Multi-Chip Package (MCP2) based on Altera’s AgilexTM9 SoC FPGA Direct RF-Series,” stated John Sotir, Senior Director, Military Aerospace and Government Business and State-of-the-Art Heterogeneous Integration Packaging (SHIP), Altera. “We’ve facilitated the quick development of essential defence systems to deliver greater bandwidth and performance at low latency, lower power, and in a smaller footprint through STAMP and our partnership with Lockheed Martin.”
As a recipient of a STAMP award, Lockheed Martin will push technological advancements to create a defence system that can identify and detect threats faster, more accurately, and for a far lower SWaP and cost—freeing up resources to assist other tasks. Although STAMP technology was first created for the Sikorsky MH-60R helicopter, it may be used on platforms in the air, on land, and in the sea. The AgilexTM 9 SoC FPGA Direct RF-Series from Altera reduces the defence system’s size, weight, power, and cost by an order of magnitude while enabling sophisticated digital and analog capabilities.
Lockheed Martin will combine Altera’s chips with its most recent SOSA technology over the course of the next 18 months in order to eventually deploy, test, and finish manufacturing via the U.S. Navy’s MH-60R helicopter program. Work for STAMP will be done at Lockheed Martin’s Owego, New York, site.
