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Intel Foundry and Ansys partner to advance thermal management in semiconductor design

by Staff Correspondent
June 25, 2024
access hub, newspace, defence, security, stimulating software, United States Military, Aerospace, and Government (USMAG) Alliance, thermal management technology, AI products, innovation, design methodologies, high-performance chip design, Intel, Ansys  
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Ansys stated that it will be a part of the Intel Foundry Accelerator USMAG Alliance, assisting in the development of safe and effective semiconductors for government and national security applications. In order to fully meet the requirements of military, aerospace, and government applications, Ansys’ semiconductor simulation tools will be optimized through this alliance to deliver secure design methodologies and workflows that meet the requirements of Intel Foundry’s process design kits (PDKs).

A version of the RedHawk-SC platform to design an improved thermal management flow that supports the Intel 18A silicon production process, Ansys and Intel Foundry are strengthening their technological partnership. PowerVia, the cutting-edge backside power delivery technology found in the Intel 18A, presents significant difficulties for efficiently cooling circuits, particularly for processors used in high-performance computing, artificial intelligence (AI), and graphics processing. Ansys’s developed and well-proven thermal solver technology provides predictive accuracy and the capacity for full-system analysis, resulting in better performance and greater design flexibility.

Intel’s embedded multi-die interconnect bridge (EMIB) assembly technology is being signed off on by Intel Foundry and Ansys, providing signoff verification of temperature and power integrity and mechanical durability. These capabilities cover a wide range of use cases, from different heterogeneous packaging systems to sophisticated silicon process nodes.

Ansys and Intel Foundry have collaborated to tackle intricate Multiphysics problems and fulfil demanding thermal, power, mechanical, and reliability specifications. This was stated by John Lee, vice president and general manager of Ansys’ electronics, semiconductor, and optics business unit. Ansys extensive experience in physics simulation meets the extremely complex needs of aerospace and military products. Our companies’ cooperation allows us to provide our shared clients with more value.

“We are pleased to have Ansys join our USMAG Alliance,” stated Suk Lee, vice president and general manager of Intel Foundry’s ecosystem technology office. “We now have a network of partners with Ansys that can offer the MAG community strong design and simulation capabilities for safely developing semiconductor solutions with Intel’s cutting-edge process capabilities.”

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